Automated Receptacle Alignment System (Photonics Alignment)
Sub-micron active fiber-to-chip and laser-to-PIC automated coupling.
Products & Services
Precision equipment and specialized engineering services for the semiconductor and photonics ecosystem.
Designed for what comes next.
Advanced Semiconductor Packaging System
Equipment for advanced 2.5D and 3D semiconductor integration.
Automated Testing Equipment
Wafer-level and chip-level testing and characterization solutions.
Automated Optical Inspection
Vision-driven surface and defect inspection systems.
Custom R&D Metrology & Prototyping
Custom test development, characterization and pilot solutions.
Custom Tooling & Reverse Engineering
Application-specific tooling, modules and engineering support.
From concept to validation.
Our engineering disciplines cover mechanical design, controls, software, machine vision, precision motion, system integration, manufacturing and testing.
